Comprehensive Solution for High Power Characterization

The PowerPro System Basic's

Signatone’s proprietary high voltage probe (HVP) and high current probes (HCP) were designed to meet the challenges of power device characterization at wafer level. Whether it’s 3kV trixial, 10kV coaxial, or pulsed current up to 100A, we have the right solutions to meet your needs. Our chuck technology is equally impressive in its ability to meet the electrical and physical requirements for probing power device wafers at ambient or thermal conditions. VersaPath switching mechanism facilitates the convenience of selecting chuck connection status through manual or software control.

Signatone PowerPro Brochure

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